Construction and Assembly
-
Pictures
-
Notes:
-
Front-End Electronics
-
The NIM paper describing the ASD-08 chip.
-
Drawings of the pinout of the ASD-08 in postscript
or encapsulated
postscript.
-
Measurement of the equivalent noise charge (ENC) of an ASD-08 circuit biased
at +/-2.5V
and +/-3.0V.
-
Schematics:
-
tube and pad system
-
MU3/MU4 pixel system
-
MU1/MU2 pixel system
-
Tables of card production status.
-
FED documentation.
-
Cabling:
-
MU1
-
MU2
-
MU3 and MU4
-
Shielding:
-
Drawings of the MU1 tube chamber shielding: Mt1.1
inner plate, Mt1.1
outer plate, Mt1.2
inner plate, Mt1.2
outer plate, and an assembly
view.
-
Schematics for the tube card shielding of the pad chambers (MU3 and 4):
bottom
plate, spanner
plate (view 1), spanner
plate (view 2), spanner
plate (view 3), small
L-brackets, inner
plate, outer
plate, T-bracket,
cover
plate, and an assembly
view.
-
Schematics for the pad card shielding of the pad chambers (MU3 and 4):
cover
and front
plate.
-
Inventory
of stuff collected in WSU office.
R. Harr
Last modified: Sat Nov 14 21:08:20 MET 1998